The 2nd IEEE International Conference on High Performance and Smart Computing (IEEE HPSC 2016)


Conference Committee



General Chair

Meikang Qiu Pace University, USA
Sun-Yuan Kung Princeton University, USA
Hai Jin Huazhong Science and Technology University, China

Program Chairs

Thaier Hayajneh New York Institute of Technology, USA
Shui Yu Deakin University, Australia
Yongxin Zhu Shanghai Jiaotong University, China

Publicity Chair

Keke Gai Pace University, USA
Hui Zhao Henan University, China

Local Chairs

Jian Xiong Columbia University, USA


Technical Program Committee

Lixin Tao, Pace University, USA
Hassan Takabi, University of North Texas, USA
Asimina Kiourti, The Ohio State University, USA
Carlos E. Caicedo Bastidas, Syracuse University, USA
Maria Calle, Universidad del Norte, Colombia
Razvi Doomun, University of Mauritius, Mauritius
Maria Calle, Universidad del Norte, Colombia
Sana Ullah, Polytechnic Institute of Porto (IPP), Porto, Portugal
Ghada Almashaqbeh, Columbia University, USA
Bassam J. Mohd., Hashemite University, Zarqa, Jordan
Muhammad Imran, King Saud University, Kingdom of Saudi Arabia.
Xiaofu He, Columbia University, USA
Wenjia Li, New York Institute of Technology, USA
Tao Zhang, New York Institute of Technology, USA
Zongming Fei, University of Kentucky, USA
Zonghua Gu, Zhejiang University, China
Younghee Park, San Jose State University, USA
Wei Wei, Xi'an University of Technology, China
Gang Zeng, Nagoya University, Japan
Thomas Austin, San Jose State University, USA
Sang-Yoon Chang, Advanced digital sciences center, Singapore
Jianxin Li, BeiHang, China
Jinjun Xiong, IBM Research, USA
C.L. Wang, The University of Hong Kong, China
Yu-Dong Yao, Stevens Institute of Technology, USA
Emmanuel Bernardez, IBM, USA
Jun Wu, Dept. of CSIE, National Pingtung University
Weigang Li, University of Brasilia, Brazil
Art Sedighi, Global Head of Cloud Architecture and Strategy, TD Bank, USA
Yanjie Wei, Chinese Academy of Sciences, China
Wei Yu, Towson University, USA
Zhiqiang Lin, University of Texas at Dallas, USA
Chiu Tan, Temple University, USA
Bo Luo, The University of Kansas, USA
Xin Li, Carnegie Mellon University, USA
Hai Jiang, Arkansas State University, USA
Zhipeng Wang, China Electronics Standardization Institute, China
Xingfu Wu, Texas A&M University, USA
Wenbo Zhu, Google Inc. USA
Hwajung Lee, Radford University, USA
Dean Anderso, Bank of America Merrill Lynch, USA
Yong Guan, Iowa State University, USA
Chao-Tung Yang, Tunghai University
Yi Jin, Shanghai University, China
Lei Ju, Shandong University, China
Yong Zhang, The University of Hong Kong, China
Xinjun Mao, National University of Defense Technology, China
Samee Khan, North Dakota State University, USA
Rui Mao, Shenzhen University, China
Yu Hua, Huazhong University of Science & Technology, China
Kenli Li, Hunan University, China
Jiang Xu, Hong Kong Universtiy of Science and Technology, China
Tao Zhang, Northwest Polytechnical University , China
Wen-Ping Lai, Yuan Ze University
Yunchuan Sun, Beijing Normal University, China
Yangbin Tang, National Defense University of China, China 
Jian Mao, BeiHang, China
Shuai Ma, BeiHang, China
Gang Xie, Taiyuan University of Technology, China
Zhihui Du, Tsinghua University, China
Jian Yin, Pacific Northwest National Laboratory, USA
Jiahai Yang, Tsinghua Univesity, China
Fuji Ren, The University of Tokushima, Japan
Long Fei, Google Inc. USA
Xiaofu He, Columbia University Medical Center, USA
Ukka Riekki, University of Oulu, Finland
Peng Gou, DNVGL Software, Norway
Yan Zhang, University of Oslo, Norway
Haibo Zhang, University of Otago, New Zealand
Wei Song, Nanjing University of Science and Technology, China
Pengcheng Zhang, Hohai University, China
Hao Hu, Nanjing University, China
Jidong Ge, Nanjing University, China
Suman Kumar, Troy University, USA
Hua Yin, Guangdong University of Finance & Economics, China
Peng Sun, University of Huston, USA
Nouh Sabri Elmitwally, Cairo University, Egypt




Homepage