The IEEE International Conference on Smart Cloud
(SmartCloud 2016)
November 18th-20th, 2016, New York, USA.

Committee

Honor General Chair
Sun-Yuan Kung, Princeton University, USA
General Chairs
Qing Yang, University of Rhode Island, USA
Meikang Qiu, Pace University, USA
Program Chairs
Yongxin Zhu, Shanghai Jiaotong University, China
Yan Zhang, University of Oslo, Norway
Lixin Tao, Pace University, USA
Operation Chair
Keke Gai, Pace University, USA
Local Chair
Xiaofu He, Columbia University
Publication Chair
Bo Yuan, City University of New York, USA
Workshop Chairs
Che-Lun (Allen) Hung, Providence University, Taichung
Houcine Hassan, Polytechnic University of Valencia, Spain
Web Chair
Keke Gai, Pace University, USA
Technical Program Committee
Haibo Zhang, University of Otago, New Zealand
Yongxin Zhu, Shanghai Jiaotong University, China
Hongjun Dai, ShanDong University, China
Junjie Peng, Shanghai University, China
Zongming Fei, University of Kentucky, USA
Thomas Austin, San Jose State University, USA
Denis Trystram, Grenoble university, France
Guangjie Han, Beihang University, China
Emmanuel Bernardez, IBM, USA
Dean Anderso, Bank of America Merrill Lynch, USA
Zonghua Gu, Zhejiang University, China
Younghee Park, San Jose State University, USA
Wei Wei, Xi'an University of Technology, China
Gang Zeng, Nagoya University, Japan
Bo Yuan, City University of New York, USA
Sang-Yoon Chang, Advanced digital sciences center, Singapore
Hui Zhao, Henan University, China
Jianxin Li, BeiHang, China
Jinjun Xiong, IBM Research, USA
C.L. Wang, The University of Hong Kong, China
Yu-Dong Yao, Stevens Institute of Technology, USA
Jun Wu, Dept. of CSIE, National Pingtung University
Weigang Li, University of Brasilia, Brazil
Art Sedighi, Global Head of Cloud Architecture and Strategy, TD Bank, USA
Wei Yu, Towson University, USA
Zhiqiang Lin, University of Texas at Dallas, USA
Chiu Tan, Temple University, USA
Bo Luo, The University of Kansas, USA
Xin Li, Carnegie Mellon University, USA
Hai Jiang, Arkansas State University, USA
Zhipeng Wang, China Electronics Standardization Institute, China
Yanjie Wei, Chinese Academy of Sciences, China
Xingfu Wu, Texas A&M University, USA
Wenbo Zhu, Google Inc. USA
Hwajung Lee, Radford University, USA
Yong Guan, Iowa State University, USA
Chao-Tung Yang, Tunghai University
Yi Jin, Shanghai University, China
Lei Ju, Shandong University, China
Yong Zhang, The University of Hong Kong, China
Xinjun Mao, National University of Defense Technology, China
Samee Khan, North Dakota State University, USA
Rui Mao, Shenzhen University, China
Yu Hua, Huazhong University of Science & Technology, China
Kenli Li, Hunan University, China
Jiang Xu, Hong Kong Universtiy of Science and Technology, China
Tao Zhang, Northwest Polytechnical University , China
Wen-Ping Lai, Yuan Ze University
Yunchuan Sun, Beijing Normal University, China
Yangbin Tang, National Defense University of China, China 
Jian Mao, BeiHang, China
Shuai Ma, BeiHang, China
Gang Xie, Taiyuan University of Technology, China
Zhihui Du, Tsinghua University, China
Jian Yin, Pacific Northwest National Laboratory, USA
Jiahai Yang, Tsinghua Univesity, China
Fuji Ren, The University of Tokushima, Japan
Long Fei, Google Inc. USA
Xiaofu He, Columbia University Medical Center, USA
Ukka Riekki, University of Oulu, Finland
Peng Gou, DNVGL Software, Norway
Haibo Zhang, University of Otago, New Zealand
Wei Song, Nanjing University of Science and Technology, China
Pengcheng Zhang, Hohai University, China
Hao Hu, Nanjing University, China
Jidong Ge, Nanjing University, China
Suman Kumar, Troy University, USA
Peng Sun, University of Huston, USA
Hua Yin, Guangdong University of Finance & Economics, China
Xiao Zhao, China University of Geophysics, China
Lifan Xu, AMD Research Center, USA

SmartCloud 2016